Thermaltake TG-60 heat sink compound Thermal paste 52 W/m·K 1 g

TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of52 W/m-k. and can be applied on copper or nickel-plated materials with excellent cooling performance.High Thermal ConductivityWith a thermal conductivity of 52 W/m-k. the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds. ensuring the best cooling performance.Even Better Cooling PerformanceWe’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz. we can see that compared to regular thermal compounds. TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.All-In-One Application KitTG-60 Liquid Metal Compound has an application kit. which includes a set of tools for immediate use.