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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro, Kaisi Stencil Plant for iPhone 11 Series

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro, Kaisi Stencil Plant for iPhone 11 Series

Prices updated 19 May 2026

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Product Description

1. Strong magnetic adsorption, simple operation 2. Fast and convenient soldering 3. High temperature resistance and easy heat dissipation 4. Pewter can be planted accurately at mesh position 5. No damage to the motherboard, accurate positioninSpecification: Package Weight One Package Weight 0.13kgs / 0.28lb One Package Size 15cm * 11cm * 3cm / 5.91inch * 4.33inch * 1.18inch Qty per Carton 80 Carton Weight 10.60kgs / 23.37lb Carton Size 46cm * 32cm * 32cm / 18.11inch * 12.6inch * 12.6inch Loading Container 20GP: 566 cartons * 80 pcs = 45280 pcs40HQ: 1314 cartons * 80 pcs = 105120 pcs