GIGABYTE Z690 AORUS XTREME motherboard Intel Z690 LGA 1700 Extended AT

Z690 AORUS XTREMETHE NEW KING OF GAMINGRule supreme with the Z690 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design. glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake's performance in all its gaming glory.UNPARALLELED PERFORMANCEWith technology moving so fast. GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIGABYTE Z690 Series motherboards come with upgraded power solution. latest storage standards and outstanding connectivity to enable optimize performance for gaming.​The more advanced manufacturing process and the higher core count on the new generation of CPUs. requires motherboards to utilize a more sophisticated VRM design to make CPUs run at their full potential. GIGABYTE uses fully DIRECT VRM DESIGN. high quality MOSFETs and tantalum polymer capacitors to achieve higher efficiency. lower voltage ripple and lower temperature than traditional parallel VRM design.Tantalum Polymer Capacitor- Lower impedance than regular capacitor to reduce voltage ripple​- Stable capacitance under high temperature​- Mounted right under the CPU area to stabilize CPU voltage during heavy loadingWith DIRECT VRM DESIGN and TANTALUM POLYMER CAPACITOR. Z690 motherboards transient response. voltage ripple and stability is highly improved under overclocking and heavy loading condition.GIGABYTE Z690 Motherboards are ready to work with the upcoming PCIe 5.0 devices which are expected to experience double bandwidth than the current PCIe 4.0 devices. To reach the high speed and maintain good signal integrity. Gigabyte R&D uses the low impedance PCB to provide the maximum performance.Hybrid Cores OptimizationWith new Intel Hybrid technology. GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.- Deactivate all E-Core- Zero compromise on gaming performance- Up to 20% lower CPU package power- Up to 5°C lower CPU temperatureXTREME MEMORYGIGABYTE Z690 Motherboards feature the latest DDR5 architecture and XMP 3.0 capability. The new DDR5 memory technology brings 50% more bandwidth to the platform and increases the system performance drastically by implementing Unlocked Native DDR5 Voltage. Xtreme Memory Routing and reliable SMD slot. In addition to the hardware upgrades. the user friendly UI provides full functionality to overclock higher with exclusive DDR5 tuning capability.Support for DDR5 XMP Up to 6600MHz and BeyondAORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 6600MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.Unlock DDR5 Voltage- GIGABYTE exclusive circuit design unlocks Native DDR5 voltage control- Transforms Native DDR5 memory module to Overclocked DDR5 memory- Increases DDR5 memory overclocking performance and capability- Supports all PMIC vendors for maximum compatibilityShielded Memory RoutingAll memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.Ultra Durable™ SMD DDR5 Memory ArmorGIGABYTE's exclusive stainless steel shielding design.THERMAL REACTIVE ARMORGIGABYTE Z690 Series Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU. Chipset. SSD stability and low temperatures under full load application and gaming.Fins-Array IIIGIGABYTE new generation Fins-Array III delivers the ultimate thermal performance by using Extended Irregular fins to fill all available space and vastly increases surface area. A piece of Fins-Array III heatsink surface area is larger than 2 full size ATX motherboard PCB. therefore it tremendously boost thermal efficiency and heat exchange performance.Advanced internal fins construction- 900% bigger surface.- Extended Irregular design used all available space to dissipate heat.Direct-Touch Heatpipe IIWith an extra large 8mm heatpipe and made by a new manufacturing process which has narrow down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.NanoCarbon Baseplate- Base plate made of aluminum instead of traditional iron ensures 3X thermal conductivity.- A thin layer of NanoCarbon is coated on the base plate through electrostatic adhesion to enhance thermal radiation capability.- Transfer heat from the back side PCB to the base plate so the NanoCarbon base plate can dissipate heat passively.- Effectively lowers backside PWM component temperature by 10%.NanoCarbon CoatingThis specialized nanostructure of carbon molecules has extraordinary