Akasa T6 ProGrade Max heat sink compound Thermal paste 14.8 W/m·K 4 g

Experience ultra-performing thermal paste designed to optimize heat transmission to your CPU or GPU. ensuring superior cooling efficiency and delivering exceptional thermal conductivity for maximum performance.T6 ProGrade MaxThermal Compound ProGrade Max T6Ultra Performing Thermal ConductivityOur thermal paste boasts exceptional thermal conductivity up to 14.8 W/mk. ensuring optimal heat dissipation for peak performance in high-demand applications.Non-Electrical Conductivity for SafetyNot only does our paste excel in heat transfer but is also non-electrically conductive. providing a safe and reliable solution for your electronic components. Ensure effective cooling without the risk of electrical interference.Non-Curing PropertiesExperience hassle-free maintenance with our pastes' non-curing properties. eliminating the need for waiting times. This means you can achieve peak performance right from the start. ensuring efficient cooling without delaysWipes and SpreaderMake application a breeze with our thermal paste kit. thoughtfully equipped with clean wipes (x2) and a spreader for a mess-free and convenient experience.